Vacuum and Thin Film Technology
ITRC has two missions in vacuum and thin film technology. One is to calibrate the vacuum gauges because ITRC's vacuum calibration laboratory qualifies as the national vacuum calibration laboratory, while the other mission points to material-related thin film research.
Vacuum technology is one of the cored technologies for thin film deposition applied for semiconductor manufacturing process. The measuring gauge devices of the vacuum system are required to have accurate and trusted readings to guarantee the film quality. The material behavior is strongly related to its intrinsic properties and manufacturing process variables. To satisfy different material performance requirements, ITRC establishes several thin film deposition tools and their corresponding operational know-hows. they are atomic layer deposition (ALD), pulsed laser deposition (PLD), ion-beam assisted magnetron sputtering deposition, molecular beam chemical vapor deposition, and electron beam deposition.
It is worth to be mentioned that the ALD and PLD are designed and manufactured by the center and they are the first instrument set assembles in Taiwan. Some important PLD specifications are listed below: the Nd-YAG laser pulsed width of 10 ns, the maximum power of 1 joule per pulse, and 4 optional pulsed laser wavelengths available. The ALD specifications are shown as follows: the acceptable maximum 12-inch wafer size, controllable growth temperature up to 300 °C, and hand-on materials being Al2O3, ZnO and HfO2.
To assist the communication industry and lens coating application, the high/low pass filter and special spectrum collector, the silver mirror of over 98% reflectance within visible spectrum are routinely deposited in ITRC. Reflectance and transmittance are important film parameters. To provide services to the industry and academia, the RT measuring instrument covered visible and infrared spectrum is qualified as TAF standard instrument.
Vacuum calibration laboratory in ITRC.
Pulse Laser Deposition (PLD) System developed by vacuum & thin film technology division and AlN-GaN superlattice thin films.
4-inch and 8-inch Atomic Layer Deposition (ALD) Systems developed by vacuum & thin film technology division and deposition test for high aspect ratio structure.